Mechanical Polishing &
Electropolishing – Ra < 0.1 µm

Mechanical polishing removes machining marks, scratches and micro-roughness progressively through abrasives (P80–P2000) and polishing pastes. Target roughness Ra < 0.4 µm; Ra < 0.2 µm (mirror finish) on request.

Plating quality depends directly on pre-treatment: the coating reproduces the topography of the substrate. Suitable for titanium, stainless steel, aluminium, copper and brass.

Electropolishing removes metal electrochemically in a controlled manner, smoothing micro-roughness, microcracks and burrs. Ra < 0.1 µm mirror surface. Passivation of stainless steel (chromium oxide layer) → corrosion and biofilm resistance for FDA/GMP applications.

Also suitable for inner surfaces, tube bores and complex internal geometries – mechanical polishing cannot achieve this. Standards: DIN EN ISO 15730, ASTM B912, ASME BPE (bioprocess).